Inne

https://www.rtench.com/products/smd-dip-contact-pad/


SMD & Dip Contact Pad
Installation method: SMT surface mount (SMD) reflow soldering or wave soldering

Contact Resistance: 30 milliohms Max.

Rated Current: 2A~30A (Continuous Current)

Rated Voltage: 36V AC/DC

Durability: 10,000~100,000 Times (Reciprocating Motion Lifespan)

Operating Temperature: -40°C to +120°C (Continuous Temperature)

Salt Spray Resistance 96 Hours Corrosion Test

High-Precision Mold And Parts Processing

A variety of standards are available, and samples will be sent out as soon as the same day.

Provide Customized Services

Comply With EU RoHS And Reach Standards

Product Details
Rtench SMD & Dip Contact Pads are a type of socket connector, also known as SMD Pads, Dip Pads, Surface Mount Pads, and Through-Hole Pads. They are commonly used as the socket connectors for Pogo Pin connectors and can conduct electricity or signals. The materials and electroplating processes used for SMD & Dip Contact Pads are the same as those for pogo pin connectors, ensuring stable and extremely low contact resistance. This stability and reliability in connection are maintained even with frequent mating cycles, resulting in a long lifespan.

Installation Methods for SMD & Dip Pogo Pin Contact Pads
1. Automatic placement and reflow soldering using an SMT placement machine

2. Fixation through wave soldering

Both of these installation methods are fast, highly precise, and highly automated, which can significantly improve production efficiency and product quality.

The vacuum blind hole electroplating technology is known for its superior performance, capable of quickly and accurately electroplating a layer of gold inside and outside extremely fine blind holes. This excellent electroplating process not only ensures the overall aesthetics of the metal surface but also has outstanding corrosion resistance and wear resistance. Both the inside and the outside of the hole present a bright golden color, and there will be no peeling or gold dropping issues.

By combining mature design concepts, high-precision processing techniques, and excellent vacuum blind hole electroplating technology, we can achieve extremely low and stable contact resistance.